2.5G DFB 1310nm 6.6mm TO-CAN

2.5G DFB 1310nm 6.6mm TO-CAN

Features

  • Data rate up to 2.5Gbps
  • Uncooled FP chips with MQW structure
  • Good high temperature characteristics
  • TO56 package with a Φ2.0mm glass lens
  • RoHS compliant and lead-free

Applications

  • EPON BOSA

 

Absolute Maximum Ratings (Tc=25℃)

Parameter

Symbol

Ratings

Unit

Laser Reverse Voltage

Vr(LD)

2

V

Laser Forward Current

If

120

mA

Photodiode Reverse Current

Ir

2

mA

PD reverse voltage

Vr(PD)

15

V

Storage Temperature

Tst

-40~+85

ºC

Operating Case Temperature

Tot

-20~+85

ºC

Lead Soldering (Temperature)/(Time)

-

260/10

ºC/Sec

 

Electrical and Optical Characteristics (Tc=25℃,Po=5mW,unless otherwise specified)

Parameter

Symbol

Min

Type

Max

Unit

Test Condition

Center Wavelength

lc

1290

1310

1330

nm

CW

Threshold current

Ith

 

10

15

mA

CW, 25℃

   

30

mA

CW, 85℃

Optical Power Options

Po

6.0

   

mW

CW, Iop=Ith+20mA

Operating voltage

Vop

 

1.2

1.5

V

CW, Iop=50mA

Monitoring output current

Im

100

 

1000

mA

CW, Iop=Ith+20mA

Dark current (PD)

Id

   

100

nA

VRD=10V

Slope efficiency

SE

0.25

   

W/A

CW, Iop=Ith+20mA

Spectrum width

△λ

   

2

nm

CW, Iop=Ith+20mA

Rise and fall time

Tr,Tf

 

0.2

0.3

ns

Iop=Ith+20mA, 20~80%

Beam divergence angle

J//

 

20

23

Deg

CW, Iop=Ith+20mA

J^

 

23

26

Deg

Focus length

F

6.3

6.6

6.9

mm

 

 

$35.00

Add to Cart: